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提出了一种“开路-直通”的级联结构的二端口网络的晶体管高频噪声去嵌结构以及与此相关的基于噪声相关性矩阵的去嵌方法。和传统的需要配备两个“直通”结构的方法相比较,该结构及方法在版图配合的基础上,只需要使用一个“开路”结构和一个“直通”结构,而且多个不同尺寸的被测试器件结构可以共用一个直通去嵌测试结构进行测试及去嵌,结果显示,使用该方法测试及去嵌后的精度几乎不受影响。该方法的意义在于能极大地减少硅片上直通去嵌测试结构的数量从而节省硅片面积;同时,又减少了测试时间、提高了测试效率,极大地降低了成本。
This paper proposes a high-frequency noise de-embedding structure of a two-port network with cascaded “open-thru” cascaded structure and a de-embedding method based on the noise correlation matrix. Compared with the conventional method that requires two “straight through” structures, the structure and method only need to use an “open” structure and a “straight through” structure based on the layout, and more The structures of tested devices with different sizes can share a straight-through de-embedded test structure for testing and de-embedding. The results show that the accuracy of testing and de-embedding using this method is hardly affected. The significance of this method is that it can greatly reduce the number of straight-through de-embedding test structures on the silicon wafer to save the silicon area, reduce the testing time, improve the testing efficiency and greatly reduce the cost.