世界半导体大公司的微细化能力比较

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据报道,今年世界半导体业以Intel、TSMC(台积电)、Samsung(三星)等公司为代表将跨进22nm以下的新一代微细化大量生产工艺时代,并预期2013年将进入15nm时代,或成为半导体工艺的一个新转折点。 According to reports, this year the world’s semiconductor industry will use Intel, TSMC (TSMC), Samsung (Samsung) and other companies will be sub-22nm into a new generation of miniaturized mass production process era, and is expected to enter the 15nm era in 2013 or become a semiconductor A new turning point in technology.
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