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为了微细磨削硬脆材料,开发了一种小直径、可高速旋转、比例极限应力和耐磨性皆优的电铸金刚石磨具。新开发出一种可用微粒金刚石磨料和晶粒尺寸2nm以下的电沉积Ni制作电铸磨具的电镀装置。为了提高磨具金刚石磨料与结合剂Ni的把持强度,对金刚石磨料表面进行了热腐蚀粗化。此外,磨具还采用了合成金属间合金Ni3P热处理工艺,既增加了结合剂的硬度又提高了磨具的比例极限应力。弯曲试验证实,通过采用热腐蚀金刚石磨料和热处理,磨具的杨氏模量和比例极限应力均可分别比常规法电铸金刚石磨具增加40GPa和1.5GPa左右。
In order to finely ground hard and brittle materials, an electroformed diamond abrasive with a small diameter, high-speed rotation, excellent ultimate stress and wear resistance was developed. A newly developed electroplating apparatus that can be used to make electroformed abrasives by using microparticle diamond abrasive and electrodeposition Ni having a grain size of 2 nm or less. In order to improve the gripping strength of abrasive diamond and Ni, the surface of diamond abrasive was roughed by hot corrosion. In addition, the abrasive also uses a synthetic Ni3P intermetallic alloy heat treatment process, which not only increases the hardness of the binder but also increases the proportion of the abrasive stress limit. Bending tests confirmed that by using hot-coring diamond abrasive and heat treatment, the Young’s modulus and the proportional ultimate stress of the abrasive can be increased by about 40 GPa and 1.5 GPa respectively compared with the conventional method.