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针对现有高光束质量大功率半导体激光阵列内部发光单元条宽、填充因子不断减小,腔长不断增加的发展趋势所带来的热源分布及长度变化影响器件热阻的问题,利用分离热源边界条件结合商用计算流体力学(CFD)软件FLUENT进行数值计算,获得微通道热沉热阻随阵列器件发光单元条宽、空间位置变化关系以及不同阵列腔长对应的微通道优化长度。根据优化参数制备获得无氧铜微通道热沉,并对宽1 cm,腔长1mm,条宽100μm,填充因子为25%的半导体激光阵列进行散热能力测试,冷却器外形尺寸27 mm×11mm×1.5 mm。微通道热沉热阻0.34 K/W,能够满足半导体激光阵列器件高功率集成输出的散热需求。
In order to solve the problem that the heat source distribution and length change caused by the development trend of the existing light-emitting unit in the existing high-beam quality high-power semiconductor laser array, such as wide stripe, filling factor, and cavity length, The numerical simulation was carried out with commercial computational fluid dynamics (CFD) software FLUENT to obtain the relationship between thermal resistance of microchannel heat sink and the width and spatial position of the light-emitting unit of the array device and the optimized length of the microchannels corresponding to the cavity lengths of the different arrays. According to the optimized parameters, an oxygen-free copper microchannel heat sink was obtained, and the heat dissipation capability was tested on a semiconductor laser array with a width of 1 cm, a cavity length of 1 mm, a width of 100 μm and a fill factor of 25%. The external dimension of the cooler was 27 mm × 11 mm × 1.5 mm. Microchannel heat sink thermal resistance of 0.34 K / W, to meet the semiconductor laser array devices integrated high-power output cooling needs.