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本文介绍利用现有MCVD工艺制备大芯径、大数值孔径光纤预制棒的新工艺。在不掺硼的情况下,在预制棒芯层逐层减少SiCl_4的流量,解决了为达到较高折射率差△n,在芯层掺锗过多,而引起光纤预制棒在沉积后期和缩棒过程中由材料的热膨胀系数而导致的炸裂问题。并通过改变火焰平移速度,提高了沉积速率,缩短了制棒时间。所拉制的光纤,数值孔径NA高达0.30。
This article describes the use of the existing MCVD process for preparing large core, large numerical aperture optical fiber preform of the new technology. In the case of boron-free, the flow rate of SiCl_4 was reduced in the preformed core layer one by one, which solved the problem that in order to reach the higher refractive index difference Δn, excessive doping of germanium in the core layer caused the optical fiber preform to shrink during the late deposition The sticking problem caused by the material’s thermal expansion coefficient. And by changing the flame translation speed, increased deposition rate, shorten the rod system time. The drawn optical fiber, numerical aperture NA up to 0.30.