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最近,国外科学家使用25-W氩激光器,通过产生很细的激光束穿过Au液流来加速和改善计算机互连片的生产。使用这项技术,对于高质量的、宽度小于1/50英寸的点和线其沉积速度可比传统的沉积方法快十倍以上,同时还可减少Au的损耗及简化电镀工艺。所沉积的金属(可呈复杂的电路图形)主要用于计算机系统中的电路互连片。电镀装置是一个长约6英寸的玻璃室,玻璃室中装有增压Au液流或电
Recently, foreign scientists used 25-W argon lasers to speed up and improve the production of computer interconnects by generating a very thin laser beam across the Au flow. With this technology, the deposition rate for high-quality dots and lines less than 1/50 inch wide can be more than ten times faster than conventional deposition methods while reducing Au loss and simplifying the plating process. The deposited metal, which may be in complex circuit patterns, is primarily used for circuit interconnects in computer systems. The electroplating apparatus is a glass chamber about 6 inches in length with a charged Au liquid stream or electricity