实验利用聚焦了的氩离子激光束(514.5nm)通过盛有含铜化学镀液的容器,照射于预先经过敏化成核的玻璃基片上,得到了无背景的微小铜镀点。 实验研究了入射激光强度、辐照时间对镀点厚度和大小的关系,拍摄了镀点表面形态,测绘了镀点轮廓。在实验条件下,得无背景激光增强化学镀铜的速率约7.5μm/min,较无激光 Experiments using a focused argon ion laser beam (514.5nm) through a container containing a copper-containing electroless plating solution was irradiated on a pre-sensitized nucleated glass substrate to obtain a micro background without plating. Experimental study of the incident laser intensity, irradiation time on the thickness and size of the relationship between the coating, filming the surface morphology of the coating, mapping the coating profile. Under experimental conditions, no background laser enhanced electroless copper plating rate of about 7.5μm / min, no laser