半导体器件制造中用多套掩模通过复印设备把图形印制到晶片上,各个掩模循序复印时会有晶片结构上的“迭印误差”。即使每次瞄准完全正确,也会因复印设备的缺陷和晶片的变形而产生误差。所以简便、快速地对大面积平面度和迭印精度进行测量在集成电路的制造 In the manufacture of semiconductor devices, a plurality of sets of masks are used to print the patterns onto the wafer through a copying device. Each mask has a “stacking error” on the wafer structure during sequential copying. Even if every aiming is correct, errors may also occur due to defects in the copying apparatus and deformation of the wafer. So easy and fast measurement of large area flatness and stacking accuracy in the manufacture of integrated circuits