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采用透射电子显微镜对粉末冶金法制备的Y_2O_3/Ag复合材料的界面微观结构进行了深入研究。结果表明:复合材料界面结合紧密且无任何反应物。Ag基体的(111)面与Y_2O_3颗粒的(440)晶面保持半共格关系:Y_2O_3(222)//Ag(111),Y_2O_3(440)//Ag(111),界面处基体中可以看到由于晶格错配而产生的刃位错,说明基体与增强颗粒晶面间距接近时,基体可以依靠增强颗粒表面结晶并长大,即增强颗粒作为基体异质形核的质点,并从晶体学角度对界面的形成原因进行了解释。由力学和电学性能测试得到复合材料的强度和电阻率随Y_2O_3含量的增加而升高。
The interfacial microstructure of Y_2O_3 / Ag composite prepared by powder metallurgy was investigated by transmission electron microscopy. The results show that the interface of composites is tightly bonded without any reactants. The (111) plane of the Ag matrix and the (440) plane of the Y_2O_3 particles maintain a semi-coherent relationship: Y_2O_3 (222) // Ag (111) and Y_2O_3 (440) // Ag To the dislocation caused by the lattice dislocation, indicating that the matrix and the enhanced particle spacing close to the surface, the substrate can rely on enhanced particle surface crystallization and growth, that is, to enhance the particles as the matrix heterogeneous nuclei particle, and from the crystal The angle of the study explained the reasons for the formation of the interface. The mechanical properties and electrical properties of the composite obtained by the strength and resistivity increased with the Y 2 O 3 content increased.