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研究了Ce对Cu/Sn-58Bi/Cu钎焊接头显微组织和力学性能的影响规律。结果表明:Ce颗粒的添加可有效细化钎料基体组织,当Ce添加量为0.5wt%时,组织最为细小弥散,具有较小的Sn-Bi两相片层间距;铺展系数随Ce含量的增加而表现出先上升后下降的趋势,Sn-58Bi-0.5Ce钎料表现出较好的铺展性能;Cu/Sn-58Bi-0.5Ce/Cu钎焊接头在获得最佳抗拉强度的同时,仍表现出较好韧性;Ce的最佳添加量为0.5wt%。
The effect of Ce on the microstructure and mechanical properties of Cu / Sn-58Bi / Cu brazed joint was studied. The results show that the addition of Ce particles can effectively refine the brazing filler metal matrix. When the Ce addition amount is 0.5wt%, the microstructure is the most finely dispersed and has the smaller Sn-Bi interphase spacing. The spreading coefficient increases with the increase of Ce content While the Sn-58Bi-0.5Ce brazing filler exhibited a good tendency of first rising and then decreasing. Cu / Sn-58Bi-0.5Ce / Cu brazing joint still showed the best tensile strength at the same time Good toughness; Ce the best amount of 0.5wt%.