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昆明贵重金属研究所近年研制的GHL-D-B膏状焊料,是一种新型的低温铅锡焊料。用铅、锡金属粉末、去蚀剂、有机填充剂混合制成膏状。铅锡成分与普通焊锡丝成分相接近,熔融温度180℃—270℃。我们采用这种焊料,在完成一批磁聚焦线圈的骨架加工中,取得了十分满意的效果。磁聚焦线圈系中国科学院高能物理研究所直线加速器工程中的部件。该所在设计这种线圈时,为尽量缩小线圈尺寸,其导线的载流密度选用得很高,接近极限值3安/毫米~2。因此线圈的温升较高。为改善线圈的散热效果,线圈骨架采用黄铜材料,并要求在挡板上焊接紫
Kunming Institute of Precious Metals GHL-D-B paste solder developed in recent years, is a new type of low-temperature lead-tin solder. With lead, tin metal powder, to erase, organic fillers made of paste. Tin and tin solder composition is close to ordinary ingredients, the melting temperature of 180 ℃ -270 ℃. We use this solder, in the completion of a number of magnetic focus coil skeleton processing, and achieved very satisfactory results. Magnetic focusing coil is a part of the linear accelerator project of Institute of High Energy Physics, Chinese Academy of Sciences. The design of this coil in the coil, in order to minimize the size of the coil, the carrier current density of its choice of very high, close to the limit of 3 A / mm ~ 2. So the coil temperature rise higher. In order to improve the heat dissipation effect of the coil, the bobbin of the coil is made of brass material, and it is required that the purple