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感应自发热重熔(ISHR)技术在电子互连的应用中具有明显的三维选择性加热和快速加热等优点.该方法能够很好地解决由于无铅钎料的应用引起的日益严重的诸多问题,如球栅阵列中各钎料球受热不均匀和芯片基板与钎料球同时受热等.为此,采用ISHR进行了无铅钎料Sn3.5Ag在Au/Ni/Cu焊盘上的重熔实验、高温老化实验以及凸台剪切实验.由实验结果可知钎料凸台可以提供足够的剪切强度.文中讨论了界面反应和金属间化合物的演化.在老化期间界面处生长了连续的Ni3Sn4金属间化合物层,同时在钎料体内部生成了分散的(Aux,Ni1-x)Sn4化合物.金属间化合物的生长速度与老化时间的平方根成正比,由此可以判断金属间化合物的生长是一种扩散控制过程.
Inductive self-heating remelting (ISHR) technology has the obvious advantages of three-dimensional selective heating and rapid heating in the application of electronic interconnection, which can well solve the increasingly serious problems caused by the application of lead-free solder Such as uneven heating of the solder balls in the ball grid array and simultaneous heating of the chip substrate and the solder balls, etc. For this reason, ISHR was used to remelt the lead-free solder Sn3.5Ag on the Au / Ni / Cu pad Experiments, high temperature aging experiments and boss shearing experiments.The results show that the solder bosses can provide enough shear strength.The interface reactions and the intermetallic compounds evolution are discussed.The Ni3Sn4 Intermetallic compound layer and a dispersed (Aux, Ni1-x) Sn4 compound is formed inside the brazing filler metal body, the growth rate of the intermetallic compound is proportional to the square root of the aging time, and it can be judged that the growth of the intermetallic compound is one Diffusion control process.