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原位观察交变电流作用下纳米晶铜互连线的表面损伤形貌演化过程,重点研究了交变热-机械载荷作用下硅基铜互连线的电致热疲劳性能。结果表明,铜互连线电致热疲劳寿命随着电流密度的增加而减小;载流铜互连线表现出新的变形方式,具有独特的电致热疲劳行为特征。在低电流密度(j<10 MA/cm~2)条件下,在电致热疲劳中应力控制的晶粒挤出损伤机制起主导作用;而在高电流密度(j>10 MA/cm~2)条件下,交变电流产生的焦耳热效应起主导作用。
In situ observation of the evolution of the surface damage morphology of nanocrystalline copper interconnects under the alternating current, the thermal fatigue properties of silicon-copper interconnects under alternating thermo-mechanical loading were mainly studied. The results show that the thermal fatigue life of copper interconnection wire decreases with the increase of current density. The current-carrying copper interconnection wire shows a new deformation mode and has unique thermal fatigue behavior. Under the condition of low current density (j <10 MA / cm ~ 2), stress-controlled grain extrusion damage mechanism plays a leading role in the electric thermal fatigue; while at high current density (j> 10 MA / cm ~ ) Conditions, the Joule heating effect produced by the alternating current plays a leading role.