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采用两种不同的真空熔渗工艺制备了W80Cu20触头材料,分析了两种合金的显微组织,测定了两种合金的成分、密度、电导率、硬度和抗弯强度。对两种合金进行了真空电弧击穿试验和SF6断路器型式试验,测量其真空击穿时的截流值和击穿场强,分析了触头材料电弧烧蚀后的表面形貌,比较了两种合金的抗电弧烧蚀能力。结果表明,两步法烧骨架熔渗工艺制备的WCu合金显微组织均匀,铜相平均尺寸为4~6μm;一步法熔渗工艺制备的WCu合金中的铜相大小不一致,存在带状铜相聚集体,其最大尺寸可达80~100μm。两步法工艺制备的WCu合金的硬度、抗弯强度高于一步法制备的合金,真空击穿场强及截流值稳定,其耐电弧烧蚀能力明显高于一步法制备的合金。
W80Cu20 contact materials were prepared by two different vacuum infiltration processes. The microstructures of the two alloys were analyzed. The composition, density, electrical conductivity, hardness and flexural strength of the two alloys were measured. The vacuum arc breakdown test and SF6 circuit breaker type test were carried out on the two alloys to measure the cutoff value and breakdown field strength under vacuum breakdown. The surface morphology of the contact material after arc ablation was analyzed. Anti-arc ablation ability of alloys. The results show that the microstructure of WCu alloy prepared by the two-step calcined framework infiltration process is uniform and the average size of copper phase is 4 ~ 6μm. The size of copper phase in WCu alloy prepared by one-step infiltration process is inconsistent, Collective, the maximum size of up to 80 ~ 100μm. The WCu alloy prepared by the two-step process has higher hardness and flexural strength than those prepared by one-step process. The breakdown strength and the cut-off value in the vacuum are stable. The arc erosion resistance of the WCu alloy is obviously higher than that of the one-step alloy.