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通过对大板坯连铸结晶器铜板热电偶的实测温度数据的分析,获得了铜板温度场分布的基本规律,在考虑钢水、铸坯、铜板以及接触面介质的物理参数随温度变化的前提下,依托有限元软件ANSYS对结晶器铜板的动态温度场、耦合应力场进行动态仿真,获得了铜板在三排热电偶高度上的温度分布与耦合应力应变规律,研究结果为了解铜板的应力/变形情况以及铸坯缺陷分析提供了较好的数据参考。
Through the analysis of the measured temperature data of the copper plate thermocouple of the slab continuous casting mold, the basic law of the temperature field distribution of the copper plate is obtained. Under the premise of considering the temperature change of the physical parameters of the molten steel, the slab, the copper plate and the contact surface medium , The finite element software ANSYS was used to simulate the dynamic temperature field and the coupling stress field of the copper mold. The temperature distribution and the coupling stress and strain law of the copper plate at the height of the three rows of thermocouples were obtained. The results show that in order to know the stress / Conditions and slab defect analysis provides a good data reference.