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通过交流阻抗测试法研究了Ｃｕ－Ｓｉ３Ｎ４复合电沉积过程Ｓｉ３Ｎ４微粒对阴极电化学行为的影响，结果表明：Ｓｉ３Ｎ４粒子在电极表面存在吸附，阴极极化增加，吸附增强；吸附粒子阻碍金属离子阴极放电沉积。
The effect of Si3N4 particles on the electrochemical behavior of Cu-Si3N4 composite electrodeposited electrode was studied by AC impedance method. The results show that the adsorption of Si3N4 particles on the surface of the electrode increases, the cathodic polarization increases and the adsorption increases. Deposition.