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为了更快更准确地检测印刷电路板(PCB)上的元器件是否存在漏焊、误焊或极性倒置等装配错误,提出了一种基于类电磁机制算法的电子元器件组装结果检测方法.该方法利用类电磁机制算法强大的搜索策略和智能的寻优机制,通过随机均匀抽取目标区域坐标点产生初始种群;以改进的归一化相关函数作为目标函数,把图像的匹配同名点看作带电粒子,通过粒子的移动与更新搜索图像的最佳匹配点;引入非均匀变异算子对移动粒子操作进行了改进;给出了该方法的实现步骤和基本流程.实验结果表明,新的检测方法具有更快的收敛速度和更高的识别率,适用于PCB板的检测.
In order to detect the components on the printed circuit board (PCB) faster and more accurately, such as missing welding, wrong welding or polarity inversion, the assembly method of electronic components based on electromagnetic mechanism algorithm is proposed. This method utilizes powerful search strategy and intelligent optimization mechanism of the electromagnetic mechanism algorithm to generate initial population by uniformly and uniformly extracting coordinate points of the target area. Taking the improved normalized correlation function as an objective function, And the best fit point of the search image through the movement and renewal of the particle.Improved the operation of the moving particle by introducing the inhomogeneous mutation operator.The steps and the basic flow of the method are given.The experimental results show that the new detection The method has faster convergence speed and higher recognition rate, which is suitable for PCB board detection.