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借助于SEM、EDS、XRD等检测手段对Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头进行观察分析,研究了钎焊工艺参数及热冲击条件对Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头界面金属间化合物和力学性能的影响。结果表明:添加0.05%(质量分数)Ni能细化Sn2.5Ag0.7Cu0.1RE钎料合金的初生β-Sn相和共晶组织;钎焊温度270℃和钎焊时间240 s时,钎焊接头抗剪切强度最大达26.9 MPa,较未添加Ni的钎焊接头提高8.9%;随着热冲击周期的增加,钎焊接头界面金属间化合物层平均厚度增加,界面粗糙度先增大后减小,钎焊接头强度降低;添加0.05%Ni能够抑制接头界面金属间化合物的成长、钎焊接头强度的降低,有利于改善接头可靠性。
The Sn2.5Ag0.7Cu0.1RE0.05Ni / Cu brazed joints were observed and analyzed by means of SEM, EDS and XRD. The effects of brazing process parameters and thermal shock conditions on the Sn2.5Ag0.7Cu0.1RE0.05Ni / Cu brazing joint interface intermetallic compounds and mechanical properties. The results show that the primary β-Sn phase and eutectic microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy can be refined by adding 0.05% (mass fraction) Ni. When brazing temperature is 270 ℃ and brazing time is 240 s, The shear strength of the joint is up to 26.9 MPa, which is 8.9% higher than that of the brazed joint without addition of Ni. With the increase of the thermal shock period, the average thickness of the intermetallic compound layer at the interface of the brazed joint increases and the interfacial roughness first increases and then decreases The strength of small and brazed joints decreased. Addition of 0.05% Ni could restrain the growth of intermetallics at the joint interface and reduce the strength of brazed joint, which is beneficial to improve joint reliability.