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休斯公司圣巴巴拉研究中心和休斯技术中心是从七十年代初开始设计和制造第二代读出电子部件的。本文讨论推动这些电路发展的一些因素,如发展过程、存在的问题以及系统设计等。讨论将从读出部件的单片实施开始一直到比较新的具有较高集成度的混成方法为止。涉及的范围将包括从NMOS或PMOS向CMOS的转变、设计规则的技术的发展、产量、成本以及性能。所有这些都将表明这些发展是如何影响读出部件和第二代红外敏感器的。我们还将对ROIC枝术的今后发展作一推测。
Hughes company Santa Barbara Research Center and Hughes Technology Center from the early 1970s to design and manufacture of second-generation read electronic components. This article discusses some of the factors driving the development of these circuits, such as development processes, problems, and system design. The discussion will start with the monolithic implementation of the read-out component until a relatively new hybrid approach with a higher degree of integration. The scope to be covered will include the transition from NMOS or PMOS to CMOS, the development of technology for design rules, yield, cost, and performance. All of this will show how these developments affect the readout of components and the second generation of infrared sensors. We will also make a speculation on the future development of ROIC technique.