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在镍/钯/金最终涂饰中镍的未来The Future of Nickel in Nickel/Palladium/Gold Final Finishes今天的PCB市场应用镍/金(ENIG)与镍/钯/金(ENEPIG)组合非常广泛,但对于精细线路和高速传输PCB有其不适合之处。在未来5μm/5μm及2μm/2μm细线路中现有厚4μm~7μm镍层完全不适合,镍层也影
The Future of Nickel in Nickel / Palladium / Gold Final Finishes Today’s PCB Market Applications Nickel / gold (ENIG) and nickel / palladium / gold (ENEPIG) Fine lines and high-speed transmission PCB has its disadvantages. In the future 5μm / 5μm and 2μm / 2μm fine lines existing 4μm ~ 7μm thick nickel layer is not suitable, the nickel layer also shadow