英特尔(Intel)的研究人员Paolo Gargini日前表示,基于450mm基片的晶圆厂预计将在2012～2014年出现,可能耗资40～50亿美元。在英特尔总部举行的报告会上,英特尔演示了一个400mm的晶圆基片。Gargini指出,产业很可能赞同把450mm基片作为下一代晶圆尺寸。英特尔和其它芯片厂商正在开 Paolo Gargini, an Intel researcher, said recently that fabs based on 450mm wafers are expected to appear in 2012-2014 and may cost between $ 4 billion and $ 5 billion. At the Intel headquarters briefing, Intel demonstrated a 400mm wafer substrate. Gargini pointed out that the industry is likely to agree with the 450mm substrate as the next generation of wafer size. Intel and other chip makers are opening