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利用电子束蒸镀实现了Ti/Ni/Au多层膜在CVD金刚石膜上的金属化 ,并研究了预处理和后处理工艺对多层膜在基底上结合的影响 ,发现高温预处理对多层膜和基底的结合有明显的改善。参照国标GJB 12 6 86进行了热循环试验 ,未发现多层膜从金刚石膜脱落。利用背散射谱研究了Ti/Ni/Au金属化体系在真空中分别加热 4 0 0℃和 50 0℃ ,6 0min金属层的热稳定性。结果发现 :优化工艺金刚石膜和金属层间的良好结合和稳定性满足金刚石膜热沉应用的要求。
The metallization of Ti / Ni / Au multilayer films on CVD diamond films was achieved by electron beam evaporation. The effects of pretreatment and post-treatment processes on the bonding of multilayer films on the substrate were investigated. The combination of the film and the substrate is significantly improved. Reference to the national standard GJB 12 6 86 thermal cycling test, did not find the multilayer film from the diamond film off. The thermal stability of the Ti / Ni / Au metallization system was investigated by backscattering spectroscopy in a vacuum atmosphere at 400 ℃ and 500 ℃ respectively for 60min. The results show that the optimized combination of diamond film and metal layer and the stability meet the requirements of diamond film heat sink application.