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利用等通道转角挤压(Equal Channel Angular Pressing,简称ECAP)工艺制备超细晶块体纯铜,并研究了其微观组织和硬度的变化。结果表明:纯铜塑性优良,在室温下能够顺利进行ECAP挤压,累积塑性变形量大于100%;经过两道次C形路线挤压可将纯铜晶粒细化至10μm以下,达到超细晶,同时硬度提高4倍以上:ECAP工艺制备的超细晶纯铜可用于制作较高强度的连接受力部件。
The ultrafine-grained pure copper was prepared by Equal Channel Angular Pressing (ECAP) process and its microstructure and hardness were studied. The results show that the pure copper has excellent plasticity, ECAP extrusion can be carried out smoothly at room temperature, and the accumulated plastic deformation is more than 100%. After two passes of C-shaped route, the pure copper grains can be refined to below 10μm, Crystal, while increasing the hardness of more than 4 times: ECAP process preparation of ultrafine grained copper can be used to produce higher strength of the connection force components.