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随着半导体行业的飞速发展,集成电路特征尺寸的微细化,半导体薄膜表面的高平坦化对器件高性能、低成本、高成品率有着重要的影响。作为唯一能实现全局平坦化方法的化学机械抛光(CMP),近年来发展迅速,应用广泛。文章综述了化学机械抛光技术的发展现状:包括化学机械抛光设备、抛光液、抛光机理模型及应用研究进展;在此基础上,对CMP下一步发展的方向及其应用前景进行了展望。
With the rapid development of the semiconductor industry, the miniaturization of the integrated circuit feature size and the high planarization of the semiconductor film surface have an important impact on the high performance, low cost and high yield of the device. As the only chemical mechanical polishing (CMP) method that can realize global planarization, it has been developed rapidly and widely used in recent years. In this paper, the development status of chemical mechanical polishing (CMP) technology is summarized including the progress of chemical mechanical polishing equipment, polishing liquid, polishing mechanism model and application research. On this basis, the prospect of future CMP development and its application prospect are prospected.