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在反应釜中按一定比例加入苯酚、甲醛和氢氧化钡,加热搅拌2～3 h,然后加入硼酸进行反应;反应产物在0.085 MPa下真空脱水,然后加入有机硅,维持温度在100℃左右反应1～2 h,再经真空脱水,得到粘度适中的含硼硅酚醛树脂(BSPR)。采用FT-IR对BSPR树脂的结构进行分析表明,酚醛树脂的分子链中含有硼氧基团和硅氧基团,BSPR具有明显的高邻位树脂结构。采用TGA对BSPR的耐热性进行测试表明,BSPR有良好的耐热性和阻燃性。
Adding phenol, formaldehyde and barium hydroxide in a certain proportion in a reaction kettle, heating and stirring for 2 to 3 hours, then adding boric acid to carry out reaction; vacuum dehydrating the reaction product under a pressure of 0.085 MPa, then adding the silicon and maintaining the temperature at about 100 DEG C 1 ~ 2 h, and then vacuum dehydration, to obtain a moderate viscosity boron-containing silicon phenolic resin (BSPR). FT-IR analysis of the structure of BSPR resin shows that the molecular chain of the phenolic resin contains a boronoxy group and a silicon oxygen group, and the BSPR has a remarkably high ortho-position resin structure. TGA test of heat resistance of BSPR shows that BSPR has good heat resistance and flame retardancy.