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采用等离子活化烧结技术将Cu箔和Al箔扩散结合制备出Cu/Al叠层复合材料。利用扫描电镜(SEM),透射电镜(TEM),电子探针(EPMA)以及X射线衍射(XRD)的分析手段考察Cu/Al界面的微结构和相组成。并基于界面扩散反应的有效生成热理论和热力学分析探讨Cu/Al界面相的生成机制。结果表明:在400～500℃温度范围内,按照从铜侧到铝侧的顺序,界面由Al4Cu9,AlCu和Al2Cu金属间化合物层构成;根据有效生成热模型分析,Al2Cu相在界面最先形成。
The Cu / Al laminated composite was prepared by diffusion-bonding Cu foil and Al foil by plasma activated sintering. The microstructure and phase composition of the Cu / Al interface were investigated by scanning electron microscopy (SEM), transmission electron microscopy (TEM), electron probe (EPMA) and X-ray diffraction (XRD) The formation mechanism of Cu / Al interfacial phase was also discussed based on the effective heat generation theory and thermodynamic analysis of interfacial diffusion reaction. The results show that the interface is composed of Al4Cu9, AlCu and Al2Cu intermetallic compounds in the order of copper side to aluminum side in the temperature range of 400-500 ℃. According to the analysis of the effective thermal model, the Al2Cu phase is the first to form at the interface.