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研究Mg/Cu接触反应共晶液相产生的方向性以及共晶液相在Mg、Cu基体表面的铺展行为,揭示了加热温度和保温时间对共晶液相在铜基体表面铺展面积的影响规律。结果表明,Mg-Cu共晶液相优先在Cu/Mg扩散偶的镁一侧形成,其与基体存在润湿铺展和晶间渗透两种作用,其中共晶液在铜基体上以润湿铺展为主,而在镁基体上以晶间渗透为主。加热温度520℃、保温时间超过15 min时,Cu/Mg扩散偶共晶液相开始在铜基体表面铺展,随着保温时间的延长,铺展面积呈现先快速增加后慢速增加的变化规律。随着加热温度的升高,Cu/Mg扩散偶共晶液相在铜基体表面的铺展面积呈现先增加后减小的变化规律。
The orientation of the eutectic liquid phase of Mg / Cu contact reaction and the spreading behavior of eutectic liquid phase on the surface of Mg and Cu matrix were investigated. The influence of heating temperature and holding time on the spreading area of copper matrix was revealed . The results show that the liquid phase of Mg-Cu eutectic preferentially forms on the magnesium side of the Cu / Mg diffusion couple, which has wetting spreading and intergranular penetration with the substrate. The eutectic liquid spreads on the copper substrate by wetting Mainly in the magnesium matrix to intergranular infiltration based. When the heating temperature is 520 ℃ and the holding time is longer than 15 min, the Cu / Mg diffusion eutectic liquid phase spreads on the surface of copper matrix. With the extension of holding time, the spreading area presents the slowly increasing first and then increasing slowly. With the increase of the heating temperature, the spreading area of the Cu / Mg diffusion eutectic liquid phase on the copper substrate surface first increases and then decreases.