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本文着重研究了陶瓷与钢在真空扩散焊接条件下,在铜的接触表面上显微凸起的塑性变形和物理接触形成过程的动力学及其对焊接质量的影响。研究了陶瓷与饲真空扩散焊接工艺和接头的机械性能和真空性能。给出了能满足电真空器件要求的扩散焊接工艺规范。
This paper focuses on the plastic deformation of micro-bump on the contact surface of copper and the kinetics of physical contact formation and its effect on the welding quality under the conditions of vacuum diffusion welding of ceramic and steel. The mechanical and vacuum properties of ceramic and feed vacuum diffusion welding processes and joints were investigated. The specifications of diffusion welding which can meet the requirements of electric vacuum devices are given.