因为封装/装配/测试可占到MEMS成本的60%,所以用新的方法来实施这些工艺对于商业化而言至关重要历史上,在MEMS(微机电系统)整个成功商业化的进程中,封装/装配/测试(P/A/T)对于器件研发而言只占据着无关紧要的位置。最开始,MEMS实际上是独立的器件,它被插入到特别订制的机械外壳或标准IC封装中,并以随机的方式进行测试。而现在,MEMS真正地变成了系统(正如MEMS中的S(system)所体现的那 Because packaging / assembly / testing can account for up to 60% of the cost of MEMS, implementing these processes with new approaches is crucial to commercialization Historically, throughout the successful commercialization of MEMS (micro-electromechanical systems) Package / Assembly / Test (P / A / T) for device development occupies only insignificant position. Initially, MEMS was actually a standalone device that was inserted into a specially made mechanical enclosure or standard IC package and tested in a random fashion. And now, MEMS has really become a system (as S system in the MEMS embodied