【摘 要】
:
A novel process, which was based on powder injection molding, was investigated for the fabrication of ceramic photonic bandgap structure with three-dimensional
【机 构】
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Material Science and Engineering School,Joining and Welding Research Institute
【基金项目】
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国家重点基础研究发展计划(973计划)
论文部分内容阅读
A novel process, which was based on powder injection molding, was investigated for the fabrication of ceramic photonic bandgap structure with three-dimensional diamond lattice. The SiO2-TiO2 ceramic powder was mixed with a water-soluble agent to produce slurry. The slurry was then injected into an epoxy mold with inverse diamond lattice, fabricated by the stereolitographic rapid prototyping process. To increase the density of the green compact, cold isostatic pressing was applied on the unit. Using thermal debinding, the water-soluble agent and the epoxy were extracted at 360 and 650 K, respectively. Sintering was immediately done at 950 K for 5 h and the desired three-dimensional ceramic structure was obtained. The calculated band diagram for this structure indicated the existence of an absolute photonic bandgap for all wave vectors. At 14.7-18.5 GHz, a complete band gap was located with a maximum attenuation of 30 dB at 17 GHz, when transmission was measured in the 〈100〉 direction between 10 and 20 GHz.
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