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本文从理论上分析了磁控溅射镀膜中基片的运动方式对沉积薄膜厚度均匀性的影响。在考虑了溅射环内不同位置刻蚀权重的情况下,对静止、直线往复运动(以下简称平动)、平动结合转动、平动结合转动并在折返处停留自旋四种运动方式,根据余弦定律对矩形靶在圆形基片上溅射的膜厚分布进行物理建模和仿真研究,并计算出相应的镀膜均匀度。研究结果表明,相比静止模式,平动时的膜厚均匀性有显著改善,平动结合转动的膜厚均匀性优于平动模式;但在前三种模式下,基片上的膜厚分布均为中心厚,边缘薄。而当采用第四种模式时,膜厚分布不再呈单调下降的趋势,延长停留时间会使膜厚分布发生翻转,变为中间薄、边缘厚,中间存在一个最佳的停留时间使得膜厚均匀性最好。
In this paper, the influence of substrate motion on the thickness uniformity of the deposited films is analyzed theoretically. Considering the etching weight of different positions in the sputtering ring, the static and linear reciprocating motion (hereinafter referred to as the translational motion), the translational translational rotation, the translational translational rotation and the retention of the four spinning modes at the reentry, According to the law of cosine, the film thickness distribution of the rectangular target sputtered on the circular substrate was physically modeled and simulated, and the corresponding coating uniformity was calculated. The results show that compared with the rest mode, the uniformity of the film thickness during translation is significantly improved, and the film thickness uniformity of the translational motion is better than that of the translational mode. However, in the first three modes, the film thickness distribution Are thick center, thin edge. When using the fourth mode, the film thickness distribution is no longer monotonous downward trend, prolonging the residence time will make the film thickness distribution flip, into the middle of the thin, thick edges, the middle there is an optimal residence time makes the film thickness Best uniformity.