二十多年来,集成电路(IC)及其在数字计算机中的应用已取得很大的成果,最近它又面临着重大的变革,正在进入超大规模集成的研究阶段。由于采用像电子束和x光刻蚀这一微细加工技术,将会进一步大大提高其性能、降低其成本,从而对数字计算机的发展产生巨大的推动。然而,从器件物理的观点来看,以不断缩小器件几何尺寸来获得高性 For more than two decades, integrated circuits (ICs) and their applications in digital computers have yielded great results. Recently, it has undergone major changes and is entering the stage of very large-scale integrated research. The use of microfabrication techniques such as electron beam and x-ray lithography will further boost their performance and cost and create a huge boost to digital computer development. However, from a physical point of view of the device, high geometries