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采用硅烷偶联剂KH550对氮化硼粉末(BN)进行了表面改性,并制备了氰酸酯树脂/氮化硼导热复合材料。研究了BN含量对复合材料的导热性能、电绝缘性能的影响,并运用扫描电子显微镜对材料的断面形貌进行了观察。结果表明:少量BN的加入能有效改善氰酸酯复合材料的导热性能,且复合材料仍保持良好的电绝缘性能。当BN的体积分数达到23.6%时,复合材料的导热系数为1.33W·m-1·K-1,为纯树脂材料的4.6倍。
The boron nitride powder (BN) was surface modified with silane coupling agent KH550, and the cyanate resin / boron nitride thermal conductive composite was prepared. The effects of BN content on the thermal conductivity and electrical insulation properties of the composites were studied. The cross-sectional morphology of the composites was observed by scanning electron microscopy. The results show that the addition of a small amount of BN can effectively improve the thermal conductivity of the cyanate ester composite, and the composite still retains good electrical insulation properties. When the volume fraction of BN reaches 23.6%, the thermal conductivity of the composite is 1.33W · m-1 · K-1, which is 4.6 times that of the pure resin.