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化学抛光是靠化学试剂的溶解作用得到光亮的抛光表面。此法对于大工件,较硬或不便切取的金相试样可直接进行抛光,比常规的机械抛光速度快。化学抛光液的配方:蒸馏水(30～40℃)16ml;草酸1g;双氧水(≥29%)16ml:氢氟酸(≥42%)1ml。
Chemical polishing is based on the dissolution of chemical reagents to obtain a bright polished surface. This method for large workpieces, hard or inconvenient to cut the metallographic specimens can be directly polished, faster than conventional mechanical polishing. Chemical polishing solution formula: distilled water (30 ~ 40 ℃) 16ml; oxalic acid 1g; hydrogen peroxide (≥ 29%) 16ml: hydrofluoric acid (≥ 42%) 1ml.