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据新加坡Tachyon Semiconductor公司报道,该公司开发了新型的3D半导体芯片技术。高密度匹配型3D芯片堆叠技术是利用铜对铜的热扩散来键合芯片,而不用附着或是介电层。
According to Singapore-based Tachyon Semiconductor, the company has developed a new type of 3D semiconductor chip technology. High-density matching 3D chip stacking technology is the use of copper thermal diffusion of copper to bond the chip, without the attachment or dielectric layer.