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薄膜初生过程对薄膜的结构,界面的形成和性能有着重要的影响.真空蒸发沉积薄膜的大量研究表明:薄膜的生长方式主要有3种:层状方式(Frank-van der Merwe Mode,FMMode)、岛状生长(Volmer-Weber Mode,VW Mode)和层岛混合型(Stranski-KrastanovMode,SK Mode).基片的种类、位向、表面状况和沉积温度对薄膜的初生过程也有较大的作用.然而,作为薄膜制备的主要方法之一的离子束溅射成膜初生过程的研究尚少见报道.由于离子束溅射成膜速度快、质量优、易控制而得到广泛应用.本文应用扫描Auger能谱仪原位研究离子束溅射纯元素成膜的初生过程.利用能谱仪的超高真空环境和二次离子枪完整地重复了正常的离子束溅射铜,铁元素的成膜过程,较为直观地了解了溅射成膜的整个过程.
The primary process of the film has an important influence on the structure of the film, the formation and the performance of the interface.Numerous studies on the vacuum evaporation of the deposited film indicate that there are mainly three kinds of growth methods: the Frank-van der Merwe Mode (FMMode) Volmer-Weber Mode (VW Mode) and Stranski-Krastanov Model (SK Mode). The type, orientation, surface condition and deposition temperature of the substrate also play a significant role in the nascent growth of the films. However, as one of the main methods of thin film preparation, the research on the primary process of ion-beam sputtering film-forming has not been reported yet.Because the ion beam sputtering has the advantages of fast film forming, good quality and easy control, Spectrometer in-situ study of ion beam sputtering pure element film formation of the nascent process.Using the energy spectrometer ultra-high vacuum environment and the secondary ion gun completely repeat the normal ion beam sputtering of copper, iron element film formation process, More intuitive understanding of the entire process of sputtering film.