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简要地从化学和电化学两方面介绍了金镀层的退除机理，总结了几年来的实践经验，推荐了几个实用的退除配方，并就国内外一些退除液中的主要成分作了介绍。
The mechanism of gold plating removal was briefly introduced from the aspects of chemistry and electrochemistry. Several practical experiences were summarized, several practical withdrawal formulas were recommended, and the main components of some removing liquids at home and abroad were also made Introduction.