论文部分内容阅读
采用电子背散射衍射(EBSD)研究了固溶温度对旋压C-276合金超薄壁管材再结晶、晶界特征分布的影响;运用拉伸试验机和扫描电子显微镜(SEM)研究了固溶温度对合金力学性能及断口形貌的影响。结果表明:随固溶温度升高,完全再结晶比率上升;固溶温度为900℃时,合金未充分再结晶,完全再结晶比率为65%;固溶温度为1100℃时,完全再结晶比率达到99.4%。固溶温度高于1000℃时晶粒快速长大,固溶温度达1200℃时,平均晶粒尺寸为77.1μm。随固溶温度升高,Σ3晶界比率呈增高趋势,固溶温度900℃时,Σ3晶界所占比率为30.5%,固溶温度升高到1200℃时,Σ3晶界比率达到57.1%。固溶温度由900℃升高到1200℃,超薄壁管材室温抗拉强度Rm从1256 MPa降低到745 MPa,屈服强度Rp0.2从915 MPa降低到340 MPa,伸长率A11.3从17.5%上升到65.5%。
The effect of solution temperature on the recrystallization and grain boundary distribution of C-276 alloy thin-wall pipe was studied by electron backscatter diffraction (EBSD). The effects of solution temperature Effect of Temperature on Mechanical Properties and Fracture Morphology of Alloy. The results show that the complete recrystallization rate increases with the increase of solution temperature. When the solution temperature is 900 ℃, the recrystallization is not fully recrystallized and the complete recrystallization ratio is 65%. When the solution temperature is 1100 ℃, the complete recrystallization rate Reached 99.4%. When the solution temperature is higher than 1000 ℃, the grains grow rapidly. When the solution temperature is 1200 ℃, the average grain size is 77.1μm. With the increase of solution temperature, the ratio of Σ3 grain boundaries increases. When the solution temperature is 900 ℃, the proportion of Σ3 grain boundaries is 30.5%. When the solution temperature is increased to 1200 ℃, the Σ3 grain boundary ratio reaches 57.1%. The solution temperature increased from 900 ℃ to 1200 ℃. The room temperature tensile strength Rm decreased from 1256 MPa to 745 MPa, the yield strength Rp0.2 decreased from 915 MPa to 340 MPa, the elongation A11.3 decreased from 17.5 % Rose to 65.5%.