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本文报导了用于耐蚀用途的微孔镀金的工艺。晶体管外引线的腐蚀断裂是长期未能解决的问题。通过在可伐引线上电镀暗镍——Ni-Al_2O_3复合镀层——酸性脉冲镀金,构成微孔金镀层体系,使腐蚀断裂倾向明显降低。
This article reports the microporous gold plating process for corrosion resistant applications. Corrosion cracking of the outer leads of the transistor is a problem that has not been solved for a long time. Nickel - Ni-Al_2O_3 composite coating - acidic pulse plating was plated on Kovar lead to form microporous gold plating system, which markedly reduced the tendency of corrosion and fracture.