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为了在较低的连接温度、连接压力和连接时间下获得高温稳定性好的陶瓷/金属接头,通过设计非对称中间层(Cu,Nb)/Ni,在连接温度为1403 K/1373 K,连接时间为50 min,连接压力为7.5 MPa,冷却速度为10 K/min的工艺条件下,采用真空扩散连接设备,进行了Si3N4/Inconel600高温合金接头的部分液相扩散连接(partial liquid phase dif-fusion bonding,PLPDB).接头的强度通过剪切试验评价,接头组织形态采用扫描电子显微镜(SEM)进行了观察和分析.实验结果表明,Cu,Nb配比、(Cu,Nb)层的厚度和连接温度影响接头的组织形态、强度与断裂.在连接温度为1403 K时,Cu,Nb配比增加,接头中的孔洞缺陷减小,接头强度提高,断裂位置从陶瓷/中间层界面向陶瓷转变.当连接温度为1403 K,Cu,Nb配比为10,(Cu,Nb)层厚度不超过0.2 mm时,随着(Cu,Nb)层厚度的增加,接头强度提高.当连接温度从1403 K降到1373 K时,接头强度明显提高.
In order to obtain ceramic / metal joints with good high temperature stability at lower connection temperature, connection pressure and connection time, the connection temperature was 1403 K / 1373 K by designing the asymmetric intermediate layer (Cu, Nb) / Ni Time was 50 min, connection pressure was 7.5 MPa, and cooling rate was 10 K / min, vacuum diffusion bonding equipment was used to carry out partial liquid phase dif-fusion of Si3N4 / Inconel600 superalloy joints bonding, PLPDB) .The strength of the joint was evaluated by shear test, and the morphology of the joint was observed and analyzed by scanning electron microscope (SEM) .Experimental results show that the ratio of Cu and Nb, the thickness and connection of (Cu, Nb) Temperature affected the microstructure, strength and fracture of the joint, and the Cu / Nb ratio increased at the bonding temperature of 1403 K, the hole defects in the joint decreased, the strength of the joint increased, and the fracture location changed from the ceramic / interlayer interface to the ceramic. When the bonding temperature is 1403 K, the ratio of Cu and Nb is 10 and the thickness of (Cu, Nb) layer does not exceed 0.2 mm, the strength of the joint increases with the thickness of (Cu, Nb) When dropped to 1373 K, the joint strength was significantly improved.