【摘 要】
：
CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated.The surface damages are ma
【机 构】
：
Key Laboratory for Precision and Non-Traditional Machining Technology Ministry of Education
【基金项目】
：
the Key Project of the National Natural Science Foundation of China
论文部分内容阅读
CdZnTe wafers were machined by lapping and mechanical polishing processes, and their surface and subsurface damages were investigated.The surface damages are mainly induced by three-body abrasive wear and embedded abrasive wear during lapping process. A new damage type, which is induced by the indentation of embedded abrasives, is found in the subsurface. When a floss pad is used to replace the lapping plate during machining, the surface damage is mainly induced by two-body abrasive and three-body abrasive wear, and the effect of embed-ded abrasives on the surface is greatly weakened. Moreover, this new damage type nearly disappears on the subsurface.
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