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氧化硅填充环氧树脂在作为芯片封装的密封中对微电子器件的可靠性与功能起着一种主要影响。在帮助了解铝引线键合内部类似功率MOS场效应晶体管的一种含铅电子组件的可靠性,在热力学机械特性试验结果表明由于栅离层的焊线接近引线框架,在键合后从-40℃到125℃的功率热循环下,导致了键合样品的一种电气开路。采用有限元模型模拟了这种封装应力,根据经验检验结果本模拟预示那些在引线键合支撑的焊跟处具有较高的平面剪切力。由数字模拟和试验数据获得的结果可作为选定适当模塑添加剂的一种指导路线。
Silicon oxide-filled epoxy plays a major role in the reliability and functionality of microelectronic devices in hermetic sealing as a chip package. In helping to understand the reliability of a lead-containing electronic component similar to an internal similar power MOS field-effect transistor in aluminum wire bonding, the results of the thermomechanical testing show that as the gate-separated bonding wire approaches the lead frame, Thermal cycling of power from 125C to 125C results in an electrically open bond to the bonded sample. This package stress was modeled using a finite element model. Based on the empirical test results, this simulation predicts higher planar shear forces at the welding heel of the wire bond support. The results obtained from numerical simulations and experimental data serve as a guideline for selecting the appropriate molding additive.