Microstructure and electric properties of Sip/Al composites for electronic packaging applications

来源 :Transactions of Nonferrous Metals Society of China | 被引量 : 0次 | 上传用户：allanvte001

【摘要】

：

Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated b

【作者】

：

修子扬武高辉张强宋美慧田首夫

【机构】

：

SchoolofMaterialsScienceandEngineering

【出处】

：

Transactions of Nonferrous Metals Society of China

【发表日期】

：

2007年A02期

【关键词】

：

电子封装硅铝复合物微观结构导电性 Si/Al composite microstructure electric conductivity elec

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Sip/1199,Sip/4032 and Sip/4019 environment-friendly composites for electronic packaging applications with high volume fraction of Si particles were fabricated by squeeze-casting technology. Effects of microstructure,particle volume fraction,particle size,

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Microstructure and electric properties of Sip/Al composites for electronic packaging applications

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