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一概述随着航空电子设备日益向小型化、数字化、综合化方向发展,相应地对印制电路板也提出了高精度、高密度和高可靠性的要求。除此之外,航空产品由于竞争的需要或者为了迅速适应战略战术改变的需要,它的更新周期变得越来越短。于是,缩短印制板设计与加工周期的呼声也越来越高。目前,一批中等复杂程度的、板面为300mm×200mm的双面板,从逻辑图到布线草图需1～2星
Overview With the increasingly miniaturization of avionics, digital, integrated direction, the corresponding printed circuit board also made high precision, high density and high reliability requirements. In addition, due to the need of competition or the need to adapt rapidly to strategic and tactical changes, aviation products have become shorter and shorter. As a result, shortening the PCB design and processing cycle of the voice is also getting higher and higher. Currently, a number of medium-complexity, 300mm × 200mm board double-sided board, from the logic diagram to the wiring sketch to be 1 or 2 stars