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日本欧姆龙公司将和美国球面半导体公司联合开发采用球面半导体技术的小型感应器,其尺寸和成本可望降到现有产品的1/10。这两家公司的联合开发小组于2002年6月开发出新型感应器试产品。球面半导体是在直径约1毫米的球状硅表面上安装集成电路,和现有的半导体相比,可装上3倍的集成电路,属新一代半导体。新型感应器将用球状的电极包裹球面半导体,在振动、倾斜、加速时会有感应。新型感应器即使算上周边电路面积也只有1平方厘米左右,尺寸和成本部不到普通半导体的1/10。由于新型感应器容易嵌入手表、移动电话、汽车方向盘和鞋底等处,可望开发出新的用途。
Japan’s Omron Corporation and American Spherical Semiconductor Corporation will jointly develop small-scale sensors using spherical semiconductor technology, the size and cost is expected to be reduced to 1/10 of the existing products. The joint development team of the two companies developed a new sensor prototype in June 2002. Spherical semiconductors are integrated circuits on a spherical silicon surface of about 1 mm in diameter. Compared with the existing semiconductors, the semiconductors can accommodate up to three times as many integrated circuits as the next-generation semiconductors. The new sensor will use spherical electrodes wrapped spherical semiconductors, vibration, tilt, acceleration will have induction. Even if the new sensor count the area around the circuit is only about 1 square centimeter, the size and cost of less than ordinary semiconductor 1/10. The new sensors are expected to develop new uses due to the ease of embedding them in watches, mobile phones, car steering wheels and soles.