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本文研究了国产普通TO型管壳中的可伐基底上镀金层与Al-1％Si丝键合后,在恒温老化过程中Au-Al之间互扩散及金属间化合物的形成情况,同时由于Kirkendall效应的存在,引起孔洞的形成而造成Au-Al系统失效。结果表明:在Au-Al键合系统中,存在着三种失效模式:HB、BL(Ⅰ)和BL(Ⅱ)型,其中BL(Ⅰ)型是致命失效,造成BL(Ⅰ)型失效的原因是Kirkendall孔洞的存在,一定的金层厚度是形成Kirkendall孔洞的必要条件,造成不同失效模式的原因是由于镀金层厚度的不均匀性而引起的。
This paper studies the mutual diffusion of Au-Al and the formation of intermetallic compounds during the aging process after the bonding of Al-1% The existence of Kirkendall effect, causing the formation of holes caused by the failure of the Au-Al system. The results show that there are three failure modes in the Au-Al bonding system: HB, BL (Ⅰ) and BL (Ⅱ), in which BL (Ⅰ) is fatal and BL (Ⅰ) The reason is that the existence of Kirkendall holes, a certain thickness of the gold layer is necessary to form Kirkendall holes, resulting in different failure modes due to the uneven thickness of gold plating caused.