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本文介绍套筒式钎焊接头的超声波探伤,详述了分割式双探头晶片的倾斜角度及延迟块的选择,并用此探头对套简式钎焊接头进行了探伤和解剖。
This article introduces the ultrasonic flaw detection of sleeve soldered joints, details the tilt angles of split double probe wafers and the choice of delay blocks, and uses the probe to inspect and dissect the sets of simple brazed joints.