论文部分内容阅读
评述了用鼓膜实验方法测试薄膜与基体界面结合强度的现状和最新进展,分析了该方法针对圆孔、膜内无残余应力柔性膜试样和矩形孔或圆孔、膜内有残余应力试样(薄膜为柔性膜或刚性膜)所用解析解力学模型建立的薄膜力学性能假设前提条件、能量平衡思路和推导过程．介绍了用硅微技术制备Si基体试样的过程,指出了制备方法和解析解力学模型的特点及所存在的问题．给出了该实验方法的应用实例,指出了需要解决非硅基体的制样和薄膜塑性变形阶段力学模型等问题．
In this paper, the present situation and the latest progress of testing the interface bonding strength between film and substrate by eardrum test method are reviewed. The method is applied to the round hole with no residual stress flexible film sample and rectangular holes or round holes. Residual stress samples (Thin film is a flexible film or a rigid film) analytical mechanics model used to establish the film mechanical properties of the preconditions, energy balance ideas and derivation process. The process of preparing Si matrix sample by using silicon micro-technology was introduced. The characteristics and existing problems of the preparation method and analytical solution mechanics model were pointed out. The application examples of the experimental method are given. The problems such as the sample preparation of the non-silicon matrix and the mechanical model of the plastic deformation phase of the film need to be solved.