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将自制的铜浆印刷在Al_2O_3陶瓷基片上,经烧结制备成铜厚膜,并利用扫描电子显微镜(SEM)和综合热分析仪(TG-DSC)分别研究了烧结过程中低温段(23~500℃)和高温段(500~850℃)的升温速率对铜厚膜微观结构和性能的影响。结果表明:在低温段,随着升温速率(30~90℃/min)的增加,铜厚膜的致密度和附着力先增大后减小,方阻先变小后变大。在高温段,随着升温速率(20~100℃/min)的增加,铜厚膜的致密度和附着力先增大后减小,方阻先变小后变大。低温段升温速率为75℃/min、高温段升温速率为60℃/min的条件下,制备的铜厚膜性能较优,致密度高、导电性好、附着力强。
The homemade copper paste was printed on Al 2 O 3 ceramic substrate, and the copper thick film was prepared by sintering. The low temperature section (23 ~ 500 ℃) during the sintering process was studied by scanning electron microscope (SEM) and integrated thermal analyzer (TG-DSC) ℃) and high temperature (500 ~ 850 ℃) heating rate on the microstructure and properties of copper thick film. The results show that the density and adhesion of copper thick film first increase and then decrease with the increase of heating rate (30 ~ 90 ℃ / min) in low temperature range. The square resistance first becomes small and then increases. At high temperature, with the increase of heating rate (20-100 ℃ / min), the density and adhesion of copper thick film first increase and then decrease, and the square resistance decreases first and then increases. Under the condition of the heating rate of low temperature is 75 ℃ / min and the heating rate of high temperature is 60 ℃ / min, the prepared copper thick film has better performance, high density, good conductivity and strong adhesion.