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提出利用层析法来解决重新复制或改进电路板布线结构难题。其原理就是对原电路板层层切割，用线阵ＣＣＤ或者摄像机或者扫描测量系统提取原线路分布结构。并与线路板ＣＡＤ接口。从而解决了旧配件复制及改进的难题。
Proposed the use of chromatography to solve the problem of re-copy or improve the wiring structure of the circuit board. The principle is to cut the original circuit board layer, with a linear CCD or camera or scanning measurement system to extract the original line distribution structure. And with the PCB CAD interface. Solve the old parts copy and improve the problem.